SCREEN Develops Industry-first SB-3300 Hybrid Type Wafer Back-side Cleaning System With Both Chemical and Brush Cleaning Functions

SCREEN Semiconductor Solutions Co., Ltd. (SCREEN SPE, president: Masato Goto), a SCREEN Holdings Group (TOKYO:7735) company, has concluded advancement of its new industry-first1 SB-3300 wafer posterior cleaning framework. The SB-3300 is outfitted with a compound carving/cleaning capacity just as an actual cleaning capacity that utilizations brushes. Deals of the framework will start in December.

The server farm market has extended altogether as of late, determined by the continuing ascent in information traffic needed for exercises, for example, far off working, e-learning and video real time. Simultaneously, fast appropriation of 5G-compatible cell phones and IoT framework basically for in-vehicle and modern applications has provoked developing interest for the refined semiconductors required by these and other front line markets.

Notwithstanding, as scaling down and coordination of the circuits for cutting edge rationale and memory ICs has improved, there has been a related decrease in yield rates brought about by rear molecule bond and distorting of wafers during their assembling measures. This issue has made cleaning of the posterior more significant than any time in recent memory and prompted developing calls for enhancements in profitability.

In light of these patterns, SCREEN SPE has built up its industry-first SB-3300 single wafer cleaning framework. The SB-3300 is uniquely intended for rear cleaning of wafers and highlights both a synthetic cleaning capacity and brush cleaning capacity that utilizes a scrubber technique.2 The framework performs substance and brush cleaning measures all the while to guarantee exceptionally powerful evacuation of particles on the posterior of wafers. These particles are a critical reason for defocusing during the photolithographic cycle of front line semiconductor gadgets.